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ENGLISH EDITION

RT-SMP® Room-Temperature Printing Wins the Ringier Technology Innovation Award (Translation)

CASMN’s proprietary RT-SMP® room-temperature printing process received a 2025 Ringier Technology Innovation Award in the personal-care industry.

Read the original Chinese article: RT-SMP®常温印刷法斩获荣格技术创新奖 →
Ringier innovation award
Ringier innovation award. Image from the original Chinese report.

CASMN's RT-SMP® room-temperature printing process received a 2025 Ringier Technology Innovation Award in the personal-care industry.

Room Temperature Stratified Microneedle Printing

The process is designed to support microneedle forming without reliance on high processing temperatures. The article describes adjustment of needle height, spacing, shape and overall patch geometry, and investigation of formulations with different solubility characteristics, including peptide-containing systems.

The source quotes a processing-area rate of 432,000 cm² per hour and annual capacity of 150 million cosmetic patches. These describe reported manufacturing conditions, not a guaranteed output for every formulation or pharmaceutical product.

RT-SMP process features
RT-SMP process features. Image from the original Chinese report.
Microneedle application areas
Microneedle application areas. Image from the original Chinese report.

Separate application pathways

Cosmetics: the report describes a clean manufacturing line and scale production of microcrystal patches.

Medical devices: the report refers to a registered Class II polymer-microneedle product and discusses possible use settings. Any actual indication must remain within the applicable registration and instructions.

Pharmaceutical formulations: the Beijing pilot facility supports development and sample preparation. The original article discusses work through Phase II and registration-related support in China, the United States and Europe; scope and compliance must be established for each project, rather than treated as blanket approval or a universal service commitment.

Applications discussed in the report
Applications discussed in the report. Image from the original Chinese report.
Company recognition shown in the original article
Company recognition shown in the original article. Image from the original Chinese report.